Upcoming Intel 9th Gen Processors to use Improved Thermal Interface Material

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According to Eurocom, Intel, will return to using a soldered thermal interface material (TIM) for their upcoming 9th Generation Core i9 and i7 processors (9900k and 9700k respectively).  The TIM is the material used to transfer heat from the CPU's silicon to the integrated heat spreader that is attached to the top of the CPU die. This will come as good news to those who love to overclock and push to get the most out of their systems.  The new soldered interface should allow for significantly better heat transfer and more efficient cooling.

There is no word on if the new TIM will be used across the entirety of the 9th Generation processor lineup but this is good news nonetheless.  We should know more soon as we approach Intel's 9th Gen launch.  For more information please feel free to visit the link.  Happy Overclocking!

 

Thumbnail source: pcgamer.com

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